| Catalog Description: | Introduction to the principles of micromachining technologies. Topics include cleanroom technology, materials, substrate and wafer fabrication (from sand to poly crystalline Si to wafer, CZ, FZ, NTD), introduction to vacuum technology, oxidation and oxidation kinetics, layer modification
(doping, ion implantation, diffusion, barriers, SIMOX, etc.) , CVD, PVD, Electroplating, Lithography, layer patterning (dry and wet etching), bulk and surface micromachining, wafer bonding (anodic, fusion, eutectic), alternative processes (LIGA, FOTURAN, etc.), packaging (wire bonding, lead frames, flip-chip, MCM, packages), economical considerations (project planning, cost planning and budgeting, production cost and projections) The course also includes a lab that all students sign up for in class. |
